HONOR
The company has a number of related core technology patents, is Taiwan and the mainland atomization forming BGA tin ball technology patent holders. Among them, the BGA tin ball less than 0.25mm is listed as one of the key projects of the national 863(" 863 "plan). The products conform to JIS Z3282 standard, all passed SGS certification, and obtained ISO certificate...
ChongQing Qunwin Electronic Materials Co, Ltd. is a national high-tech innovative enterprise specializing in r&d and production of electronic packaging materials.Our company has a number of related core technology patents.And it also is the owner of Taiwan and the mainland atomization forming BGA solder ball technology patent.
2018-12-27
The factory
The company has set up a new product research and development center, and has maintained a good cooperative relationship with many domestic universities, has been successful in the development of ordinary tin cylinder, copper core ball, micro-spring ring, enhanced tin cylinder and other high-end packaging electronic solder filler metal, to fill in the domestic technical gaps.
2018-12-27
The factory
The company has set up a new product research and development center, and has maintained a good cooperative relationship with many domestic universities, has been successful in the development of ordinary tin cylinder, copper core ball, micro-spring ring, enhanced tin cylinder and other high-end packaging electronic solder filler metal, to fill in the domestic technical gaps.
2018-12-27
The factory
The company has set up a new product research and development center, and has maintained a good cooperative relationship with many domestic universities, has been successful in the development of ordinary tin cylinder, copper core ball, micro-spring ring, enhanced tin cylinder and other high-end packaging electronic solder filler metal, to fill in the domestic technical gaps.
15223848168
